TMS320F28062PZT

Technical Specifications

Product Introduction

Features

• High-Efficiency 32-Bit CPU (TMS320C28x) - 90 MHz (11.11-ns Cycle Time)
• 16x16 and 32x32 Multiply and Accumulate (MAC) Operations
• 16x16 Dual MAC
• Harvard Bus Architecture
• Atomic Operations
• Fast Interrupt Response and Processing
• Unified Memory Programming Model
• Code-Efficient (in C/C++ and Assembly)
• Floating-Point Unit (FPU) - Native Single-Precision Floating-Point Operations
• Programmable Control Law Accelerator (CLA) - 32-Bit Floating-Point Math Accelerator - Executes Code Independently of the Main CPU
• Viterbi, Complex Math, CRC Unit (VCU) - Extends C28X Instruction Set to Support Complex Multiply, Viterbi Operations, and Cyclic Redundency Check (CRC)
• Embedded Memory - Up to 256KB of Flash - Up to 100KB of RAM - 2KB of One-Time Programmable (OTP) ROM
• 6-Channel Direct Memory Access (DMA)
• Low Device and System Cost - Single 3.3-V Supply - No Power Sequencing Requirement - Integrated Power-on Reset and Brownout Reset - Low-Power Operating Modes - No Analog Support Pin
• Endianness: Little Endian
• JTAG Boundary Scan Support - IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Clocking - Two Internal Zero-Pin Oscillators - On-Chip Crystal Oscillator/External Clock Input - Watchdog Timer Module - Missing Clock Detection Circuitry
• Peripheral Interrupt Expansion (PIE) Block That Supports All Peripheral Interrupts
• Three 32-Bit CPU Timers
• Advanced Control Peripherals
• Up to 8 Enhanced Pulse-Width Modulator (ePWM) Modules - 16 PWM Channels Total (8 HRPWM-Capable) - Independent 16-Bit Timer in Each Module
• Three Input Enhanced Capture (eCAP) Modules
• Up to 4 High-Resolution Capture (HRCAP) Modules
• Up to 2 Enhanced Quadrature Encoder Pulse (eQEP) Modules
• 12-Bit Analog-to-Digital Converter (ADC), Dual Sample-and-Hold (S/H) - Up to 3.46 MSPS - Up to 16 Channels
• On-Chip Temperature Sensor
• 128-Bit Security Key and Lock - Protects Secure Memory Blocks - Prevents Reverse-Engineering of Firmware
• Serial Port Peripherals - Two Serial Communications Interface (SCI) [UART] Modules - Two Serial Peripheral Interface (SPI) Modules - One Inter-Integrated-Circuit (I2C) Bus - One Multichannel Buffered Serial Port (McBSP) Bus - One Enhanced Controller Area Network (eCAN) - Universal Serial Bus (USB) 2.0 (see Device Comparison Table for Availability) - Full-Speed Device Mode - Full-Speed or Low-Speed Host Mode
• Up to 54 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
• Advanced Emulation Features - Analysis and Breakpoint Functions - Real-Time Debug Through Hardware
• Package Options - 80-Pin PFP and 100-Pin PZP PowerPAD™ Thermally Enhanced Thin Quad Flatpacks (HTQFPs) - 80-Pin PN and 100-Pin PZ Low-Profile Quad Flatpacks (LQFPs)
• Temperature Options - T: -40℃ to 105c - S: -40℃ to 125c - Q: -40℃ to 125c (AEC Q100 Qualification for Automotive Applications)

Applications

• - Appliances - Building Automation - Electric Vehicle/Hybrid Electric Vehicle (EV/HEV) - Powertrain - Factory Automation - Grid Infrastructure - Medical, Healthcare and Fitness - Motor Drives - Power Delivery - Telecom Infrastructure - Test and Measurement

Datasheet

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Compliance & Export Codes