S25FL256SAGMFIG01
Memory
Manufacturer
MPN
S25FL256SAGMFIG01
Product Type
Maximum Clock Speed
133 MHz
Package / Case
SOIC-16-300mil
Datasheet
Key Attributes
Interface: SPI
Voltage - Supply: 2.7V~3.6V
Memory Size: 256Mbit
Clock Frequency: 133MHz
Voltage - Supply: 2.7V~3.6V
Memory Size: 256Mbit
Clock Frequency: 133MHz
Technical Specifications
| Type | Description |
|---|---|
| Maximum Clock Speed | 133 MHz |
| Memory Size | 256Mbit |
| Program / Erase Cycles | 100,000 cycles |
| Data Retention - TDR (Year) | 20 Years |
| Block Erase Time(tBE) | 520ms@(256KB) |
| Write Cycle Time(tWC) | - |
| Page Programming Time (Tpp) | 250us |
| Type | Description |
|---|---|
| Standby Supply Current | 70uA |
| Operating Temperature | -40°C~+85°C |
| Features | - |
| Supply Voltage | 2.7V~3.6V |
| Interface | SPI |
| Package / Case | SOIC-16-300mil |
Features
- CMOS 3.0 Volt Core with Versatile I/O
- Serial Peripheral Interface (SPI) with Multi-I/O
- SPI Clock polarity and phase modes 0 and 3
- Double Data Rate (DDR) option
- Extended Addressing: 24- or 32-bit address options
- Serial Command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families
- Multi I/O Command set and footprint compatible with S25FL-P SPI family
- READ Commands
- Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
- AutoBoot - power up or reset and execute a Normal or Quad read command automatically at a preselected address
- Common Flash Interface (CFI) data for configuration information
- Programming (1.5 Mbytes/s)
- 256 or 512 Byte Page Programming buffer options
- Quad-Input Page Programming (QPP) for slow clock systems
- Automatic ECC - internal hardware Error Correction Code generation with single bit error correction
- Erase (0.5 to 0.65 Mbytes/s)
- Hybrid sector size option - physical set of thirty two 4-kbyte sectors at top or bottom of address space with all remaining sectors of 64 kbytes, for compatibility with prior generation S25FL devices
- Uniform sector option - always erase 256-kbyte blocks for software compatibility with higher density and future devices
- Cycling Endurance
- 100,000 Program-Erase Cycles, minimum
- Data Retention
- 20 Year Data Retention, minimum
- Security features
- One Time Program (OTP) array of 1024 bytes
- Block Protection
- Status Register bits to control protection against program or erase of a contiguous range of sectors
- Hardware and software control options
- Advanced Sector Protection (ASP)
- Individual sector protection controlled by boot code or password
- 65 nm MirrorBit Technology with Eclipse Architecture
- Core Supply Voltage: 2.7V to 3.6V
- I/O Supply Voltage: 1.65V to 3.6V (SO16 and FBGA packages)
- Temperature Range / Grade
- Industrial (-40℃ to +85℃)
- Industrial Plus (-40℃ to +105℃)
- Automotive AEC-Q100 Grade 3 (-40℃ to +85℃)
- Automotive AEC-Q100 Grade 2 (-40℃ to +105℃)
- Automotive AEC-Q100 Grade 1 (-40℃ to +125℃)
- Packages (all Pb-free)
- 16-lead SOIC (300 mil)
- WSON 6 x 8 mm
- BGA-24 6 x 8 mm
- 5x5 ball (FAB024) and 4x6 ball (FAC024) footprint options
- Known Good Die and Known Tested Die
Datasheet
Alternative Parts
Common S25FL256SAGMFIG01 alternatives overseas buyers search for:
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS3 |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Type | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
Sourcing Information
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