Rayson

RS2G32LO5D4FDB-31BT

Memory

Manufacturer
RaysonAsian Brands
MPN
RS2G32LO5D4FDB-31BT
Product Type
Memory
Maximum Clock Speed
1.067 GHz
Package / Case
FBGA-315
Datasheet
RS2G32LO5D4FDB-31BT Datasheet

Technical Specifications

TypeDescription
Maximum Clock Speed1.067 GHz
Refresh Current-
Memory Size64Gbit
Memory FormatLPDDR5X SDRAM
TypeDescription
Operating Temp-25°C ~ +85°C
FeaturesZQ calibration function;Asynchronous reset function;Data mask function
Working Voltage V1.825 V
Package / CaseFBGA-315

Product Introduction

64Gbit 1.067GHz LPDDR5X SDRAM FBGA-315(12.4x15) Memory

Features

  • 17.1 GB/s maximum bandwidth per channel
  • Frequency range: 1067 - 5 MHz (data rate range per pin: 8533–40 Mb/s with WCK·CK = 4:1)
  • Selectable CKR (WCK:CK = 2:1 or 4:1)
  • Single x16 channel/die
  • Double-data-rate command/address entry
  • Differential command clocks (CK_t/CK_c) for high-speed operation
  • Differential data clocks (WCK_t/WCK_c)
  • Optional differential read strobe (RDQS_t/RDQS_c)
  • 16n-bit or 32n-bit prefetch architecture
  • Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
  • Background ZQ calibration/command-based ZQ calibration
  • Optional link protection (link ECC)
  • Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
  • Ultra-low-voltage core and I/O power supplies:
  • VDD1 = 1.70 - 1.95V; 1.8V NOM
  • VDD2H = 1.01 - 1.12V; 1.05V NOM
  • VDD2L = VDD2H or 0.87–0.97V; 0.9V NOM
  • VDDQ = 0.5V NOM or 0.3V NOM (ODT off)
  • I/O characteristics:
  • Interface - LVSTL 0.5/0.3
  • I/O type: Low-swing single-ended, VSS terminated
  • VOH - compensated output drive
  • Programmable VSS on-die termination (ODT)
  • Non target ODT support
  • DVFSQ support
  • Low power features:
  • DVFSC: Dynamic voltage frequency scaling core
  • Single-ended CK, single-ended WCK and single-ended RDQS
  • Data copy
  • Write X
  • VDD1/VDD2H/VDD2L/VDDQ (ODTon)/ F (ODT/off): 1.8V/1.05V/0.9V/0.5V/0.3V
  • Array configuration:
  • 1 Gig x 32 (2 channels x16 I/O) 1G32
  • 2 Gig x 32 (2 channels x16 I/O) 2G32
  • Device configuration:
  • 1616x2 die in package D2
  • 1616x4 die in package D4
  • FBGA "green" package: 315 - ball TFBGA 12.4mmx15mmxDB 1.0±0.1mm
  • Speed grade, cycle time (tWCK): 6400 Mb/s -31
  • Operating temperature: -25℃ to +85℃

Datasheet

📄 Open Download

Compliance & Export Codes

TypeDetails
ECCN-
CNHTS8542329000
USHTS8542320071
TARIC8542329000
TypeDetails
CAHTS8542330000
BRHTS85423299
INHTS85423200
MXHTS8542.32.99

Sourcing Information

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