NXP Semiconductors

QN9080DHNE

RF & Wireless (Chips & Antennas)

Manufacturer
MPN
QN9080DHNE
Package / Case
HVQFN-48-EP(6x6)
Key Attributes
Ultra-low-power Bluetooth 5 system-on-chip (SoC) solution

Technical Specifications

TypeDescription
Data Rate1.5 Mbps
Sensitivity-95dBm
Frequency Range2.4GHz~2.4835GHz
ApplicationsBluetooth
Interface TypeI2C;SPI;UART;USB
Receive Current3.5mA;5mA
Current Of Transmitting3.5mA;7.1mA
TypeDescription
Typical Application Frequency2.44GHz
Output Power-20dBm
Operating Temperature-40°C~+85°C
Supply Voltage1.62V~3.6V
FeaturesSupports RSSI function;Power-on reset function;Power-off reset function;CRC check function
Typetransceiver
Package / CaseHVQFN-48-EP(6x6)

Product Introduction

The QN908x is an ultra-low-power Bluetooth Low Energy wireless MCU integrating on-chip memory, a USB 2.0 full-speed compatible device interface, and a 16-bit ADC, making it suitable for Bluetooth Smart applications.

The QN9080 integrates a 32-bit ARM Cortex-M4F core with support for Bluetooth Low Energy (v5.0)-compatible radio, link controller, Host stack, and multiple GATT profiles. The 32-bit ARM Cortex-M4F MCU and on-chip memory provide additional signal processing capability and range, enabling applications to run as a true single-chip Bluetooth Low Energy (v5.0) solution.

The QN908x uses a multi-layer AHB matrix to flexibly connect the ARM Cortex-M4 bus and other bus masters to peripherals, optimizing overall performance.

The QN908x is a high-performance Bluetooth Low Energy SoC single-chip platform with 10 mW peak power, simplifying the development of end products such as wearables, healthcare products, and sports and fitness trackers. Such end products also include retail beacons, connected smart appliances, smart remote controls, HID devices, asset trackers, and home automation devices.

The QN9080 integrates a Bluetooth Low Energy (v5.0)-compatible radio, link controller, Host stack, and multiple GATT profiles, providing a single-chip solution for Bluetooth Smart applications. The integrated 32-bit ARM Cortex-M4F MCU features on-chip flash memory along with a variety of analog and digital peripherals, delivering a more efficient data fusion engine suited for applications requiring intensive sensor fusion computation.

Additional system features include a fully integrated DC-DC converter, LDO, low-power sleep timer, battery monitor, high-resolution ADC, and GPIO, reducing overall system cost and form factor.

The QN908x operates over a supply voltage range of 1.62 V to 3.6 V, with very low operating current and an ultra-low-power sleep mode that extends battery life, enabling long runtime from a single coin cell battery.

Features

  • True single-chip Bluetooth Low Energy (v5.0) SoC solution
  • Integrated Bluetooth LE radio, protocol stack, and application profiles
  • Supports Central and Peripheral roles
  • Supports simultaneous Master/Slave operation
  • Supports up to 16 simultaneous links
  • Supports Secure Connections
  • Supports Data Length Extension
  • Wi-Fi/Bluetooth LE coexistence interface
  • 48-bit unique Bluetooth device address
  • RF:
  • RX sensitivity of -95 dBm at 1 Mbps mode, -92 dBm at 2 Mbps mode (LDO mode)
  • RX sensitivity of -94 dBm at 1 Mbps mode, -91.5 dBm at 2 Mbps mode (DC-DC converter mode)
  • Fast and reliable RSSI with 1 dB step size
  • TX output power from -20 dBm to 2 dBm
  • Single-ended RF port with integrated balun
  • Generic FSK modulation with programmable data rate from 250 Kbps to 2 Mbps
  • Compliant with worldwide radio frequency regulations
  • Ultra-low power consumption:
  • Single supply voltage range: 1.62 V to 3.6 V
  • Integrated DC-DC buck converter and LDO
  • 1.0 μA Power-down 1 mode, wake-up via GPIO
  • 2.5 μA Power-down 0 mode, wake-up via 32 kHz sleep timer, RTC, and GPIO
  • 3.5 mA RX current with DC-DC converter enabled (3 V supply, 1 Mbps mode)
  • 5.0 mA RX current with DC-DC converter enabled (3 V supply, 2 Mbps mode)
  • 3.5 mA TX current (TX power 0 dBm) with DC-DC converter enabled (3 V supply, 1 Mbps and 2 Mbps modes)
  • ARM Cortex-M4 core (version: r0p1):
  • ARM Cortex-M4 processor operating up to 32 MHz
  • Floating Point Unit (FPU) and Memory Protection Unit (MPU)
  • ARM Cortex-M4 built-in NVIC
  • SWD with 6 instruction breakpoints, 2 literal comparators, and 4 watchpoints, including SWO for enhanced debug capability
  • SysTick timer
  • On-chip memory:
  • 512 kB on-chip programmable flash with 2 kB page erase and write
  • 128 kB SRAM
  • 256 kB ROM
  • ROM API support:
  • Flash In-System Programming (ISP)
  • Serial interfaces:
  • 4 Flexcomm serial peripherals
  • Flexcomm0 supports USART, Flexcomm1 supports USART and I2C, Flexcomm2 supports SPI and I2C, Flexcomm3 supports SPI
  • Each Flexcomm includes a dedicated FIFO
  • I2C bus interface supports Fast mode with multiple address recognition and monitor mode
  • USB 2.0 (Full Speed) device interface
  • Two quadrature decoders
  • SPIFI uses a superset of 4-wire SPI bus to access off-chip quad SPI flash at rates far exceeding standard SPI or SSP interfaces
  • Supports SPI memory with 1 or 4 data lines
  • Digital peripherals:
  • DMA controller with 20 channels, accessing memory and DMA-capable peripherals
  • Up to 35 GPIO pins with configurable pull-up/pull-down resistors
  • GPIO registers accessible via AHB for fast access
  • 32 GPIOs selectable as Pin Interrupts (PINT), triggered by rising or falling input edges
  • AES-128 security co-processor
  • Random Number Generator (RNG)
  • CRC engine
  • Fused Signal Processor (FSP) for data fusion and machine learning algorithms with lower power consumption compared to software processing
  • Analog peripherals:
  • 16-bit ADC with 8 external input channels, sampling rate up to 32 samples/s, with multiple internal and external trigger inputs
  • Integrated temperature sensor connected to a dedicated internal ADC channel
  • Integrated battery monitor connected to a dedicated internal ADC channel
  • 8-bit 1 Msample/s general-purpose DAC
  • Integrated capacitive sensing up to 8 channels, capable of waking the MCU from low-power states
  • Two ultra-low power analog comparators capable of waking the MCU from low-power states
  • Timers:
  • 4 × 32-bit general-purpose timers/counters with capture inputs, compare outputs, PWM mode, and external count inputs
  • Sleep timer operable in and capable of waking the MCU from Power-down mode
  • 32-bit RTC with 1 s resolution, operating in the always-on power domain; capable of waking all low-power modes including Power-down mode
  • Watchdog timer
  • SCTimer/PWM
  • 32-bit ARM Cortex-M4 Bluetooth Low Energy microcontroller:
  • 16 MHz or 32 MHz crystal oscillator usable as system and RF reference
  • 32 kHz on-chip RC oscillator
  • 32.768 kHz crystal oscillator
  • Power control:
  • Programmable PMU to minimize power consumption
  • Power-saving modes: Sleep and Power-down
  • Power-On Reset (POR)
  • Brown-Out Detection (BOD) with independent thresholds for interrupt and forced reset
  • Single supply 1.62 V to 3.6 V
  • Operating temperature range: -40°C to +85°C
  • Available in 6×6 HVQFN48 and 3.28×3.20 mm WLCSP packages

Applications

  • Wearable devices
  • Health products
  • Sports and fitness trackers
  • Retail beacons
  • Connected smart appliances
  • Smart remote controls
  • HID devices
  • Asset trackers
  • Home automation

Datasheet

📄 Open Download

Compliance & Export Codes

TypeDetails
RoHSROHS3
ECCN5A992
CNHTS8542399000
USHTS8542390001
TARIC8542399000
TypeDetails
CAHTS8542390000
BRHTS85423999
INHTS85423900
MXHTS8542.39.99

Sourcing Information

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