Samsung Electronics

K4UBE3D4AB-MGCL

Memory

MPN
K4UBE3D4AB-MGCL
Product Type
Maximum Clock Speed
2.133 GHz
Package / Case
FBGA-200
Key Attributes
LPDDR4X SDRAM

Technical Specifications

TypeDescription
Maximum Clock Speed2.133 GHz
Refresh Current-
Memory Size32Gbit
Memory FormatLPDDR4X SDRAM
TypeDescription
Operating Temp-25°C ~ +85°C
FeaturesAuto self-refresh;Auto precharge function;Write leveling function;Asynchronous reset function;Data mask function;ZQ calibration function
Working Voltage V0.61 V
Package / CaseFBGA-200

Product Introduction

32Gbit 2.133GHz LPDDR4X SDRAM FBGA-200 Memory RoHS

Features

  • Double-data rate architecture; two data transfers per clock cycle
  • Bidirectional data strobes (DQS_t, DQS_c), These are transmitted/received with data to be used in capturing

Datasheet

📄 Open Download

Alternative Parts

Common K4UBE3D4AB-MGCL alternatives overseas buyers search for:

Compliance & Export Codes

TypeDetails
RoHSROHS
ECCNEAR99
CNHTS8542329000
USHTS8542320071
TARIC8542329000
TypeDetails
CAHTS8542330000
BRHTS85423299
INHTS85423200
MXHTS8542.32.99

Sourcing Information

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