Infineon Technologies

IRFL4310TRPBF

Transistors (BJT/MOSFET)

MPN
IRFL4310TRPBF
Package / Case
SOT-223
Key Attributes
MOSFET N-CH 100V 2.2A SOT-223

Technical Specifications

TypeDescription
Drain-Source Voltage100 V
Continuous Drain Current2.2 A
Chan TypeN-Channel
Pd W2.1 W
Output Capacitance(Coss)92pF
Configuration-
Gate Threshold Voltage (Vgs(th))4V
Reverse Transfer Capacitance (Crss@Vds)54pF
TypeDescription
Number1 N-channel
Input Capacitance(Ciss)330pF
Vgs±20V
Operating Temperature-55°C~+150°C
Rds On Ohm200mOhm@10V
Gate Charge C25nC@10V
TypeN-Channel
Package / CaseSOT-223

Product Introduction

Fifth Generation HEXFETs utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pickand-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.

Features

  • Surface Mount
  • Dynamic dv/dt Rating
  • Fast Switching
  • Ease of Paralleling
  • Advanced Process Technology
  • Ultra Low On-Resistance
  • Lead-Free

Datasheet

📄 Open Download

Alternative Parts

Common IRFL4310TRPBF alternatives overseas buyers search for:

Compliance & Export Codes

TypeDetails
RoHSROHS3
ECCNEAR99
CNHTS8541290000
USHTS8541290095
TARIC8541290000
TypeDetails
CAHTS8541290000
BRHTS85412910
INHTS85412900
MXHTS8541.29.99

Sourcing Information

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