ACS723KMATR-40AB-T

The Allegro ACS723 current sensor IC is an economical and precise solution for AC or DC current sensing in industrial, commercial, and communication systems. The small package is ideal for space constrained applications while also saving costs due to reduced board area. Typical applications include motor control, load detection and management, switched - mode power supplies, and overcurrent fault protection.

The device consists of a precise, low - offset, linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic field to the Hall transducer. A precise, proportional voltage is provided by the low - offset, chopper - stabilized BiCMOS Hall IC, which includes Allegro's patented digital temperature compensation, resulting in extremely accurate performance over temperature. The output of the device has a positive slope when an increasing current flows through the primary copper conduction path (from pins 1 through 4, to pins 5 through 8), which is the path used for current sensing. The internal resistance of this conductive path is 0.85 mΩ typical, providing low power loss.

The terminals of the conductive path are electrically isolated from the sensor leads (pins 9 through 16). This allows the ACS723 current sensor IC to be used in high - side current sense applications without the use of high - side differential amplifiers or other costly isolation techniques.

The ACS723 outputs an analog signal, VOUT, that changes, proportionally, with the bidirectional AC or DC primary sensed current, IP, within the specified measurement range. The BW_SEL pin can be used to select one of the two bandwidths to optimize the noise performance. Grounding the BW_SEL pin puts the part in the high bandwidth (80 kHz) mode.

The ACS723 is provided in a low - profile surface mount SOIC16 package. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the device is Pb - free, except for flip - chip high - temperature Pb - based solder balls, currently exempt from RoHS. The device is fully calibrated prior to shipment from the factory.